Method for processing a substrate using a system having a roller with treading
US6059889A · kind A · utility
12Cited by
20References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 1999 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Jan 7, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.