Apparatus and method for depositing uniform charge on a thin oxide semiconductor wafer
US6060709A · kind A · utility
50Cited by
39References
14Claims
0Family size
Inventors
Key dates
| Filing date | Dec 31, 1997 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Dec 31, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01T19/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive slit screen is placed between a corona gun and the surface of a semiconductor wafer. The charge deposited on the wafer by the gun is controlled by a potential applied to the screen. A chuck orients the wafer in close proximity to the screen. A desired charge is applied to the wafer by depositing alternating polarity corona charge until the potential of the wafer equals the potential of the screen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.