Free standing, three dimensional, multi-chip, carrier package with air flow baffle
US6061245A · kind A · utility
64Cited by
14References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1998 |
| Grant date | May 9, 2000 |
| Priority date | — |
| Expiry date | Jan 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure. Bonding sites for chips are located on regions through the carrier. Shapes which provide air baffle capabilities include coils, spring-like coils and serpentines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.