Substrate heat-treating apparatus
US6062852A · kind A · utility
33Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1998 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Apr 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate heat-treating apparatus includes a heat-treating plate, and support pins extending through the heat-treating plate to be vertically movable relative thereto. The support pins support each substrate at a lower surface thereof such that edges of the substrate are at a higher level than a central region of the substrate. This construction facilitates air flows into and out of a space between the lower surface of the substrate and the upper surface of the heat-treating plate when the substrate is vertically moved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.