Heat-treating boat for semiconductor wafers
US6062853A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1998 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Aug 31, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An heat-treating ring boat (20) for semiconductor wafers (W) has a top plate (21), a bottom plate (22), six columns (23-28), and 63 ring trays (31). The trays (31) are mounted in grooves (20a) of the columns (23-28). To fix the trays (31), a fixing rod (33) is detachably mounted between the top plate (21) and bottom plate (22). A through hole (21a) and a recessed portion (22a) to mount the fixing rod (33) therein are formed in the top plate (21) and bottom plate (22). Notches (34) to engage with the fixing rod (33) are formed in the trays (31). A notch (32) to engage with the fixing rod (33) is formed in the column (23). A projection (41) is formed on each tray (31) to abut against the side surface of the column (24).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.