Indirect endpoint detection by chemical reaction
US6066564A · kind A · utility
7Cited by
21References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1998 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | May 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, and monitoring the level of the separate product as the target film is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.