Substrate support apparatus and method for fabricating same
US6067222A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 25, 1998 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | Nov 25, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for retaining a substrate and method of fabricating same. Specifically, a Johnsen-Rahbek effect electrostatic chuck comprising a chuck body, at least one electrode disposed within said chuck body and a barrier formed around said at least one electrode. The barrier is fabricated of a material selected from the group consisting of conductive materials and semiconductive materials and in one instance is an alloy of a material of which the electrode is fabricated. Alternately, the barrier is formed of a dielectric material that is not the same material of which the chuck body is fabricated. The resultant apparatus provides an electrostatic chuck that has a reduced charge accumulation effect at the electrode/chuck body interface. Reducing charge accumulation maintains the desired electrostatic chucking forces in such a device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.