Method for real-time in-line testing of semiconductor wafers
US6069017A · kind A · utility
19Cited by
23References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 1997 |
| Grant date | May 30, 2000 |
| Priority date | — |
| Expiry date | May 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modulated light, within the probe assembly, having a predetermined wavelength and frequency of modulation, impinges upon the wafer. A sensor in the probe assembly measures the surface photovoltage induced by the modulated light. A computer then uses the induced surface photovoltage to determine various electrical characteristics of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.