Solder disc connection
US6070321A · kind A · utility
9Cited by
16References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 1997 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Jul 9, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.