Method and device of inspecting three-dimensional shape defect
US6072899A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1998 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Jan 23, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30141
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A three-dimensional shaped defect inspecting method including a three-dimensional shape detection region selecting step for detecting a two-dimensional picture signal by taking a two-dimensional optical picture fluorescence emitted from a detection object and selecting a three-dimensional shape detection region in respect of the detection object based on the detected two-dimensional picture signal, and a three-dimensional shape determining step for detecting a picture signal by taking an optical picture in accordance with a height by reflected light from the detection object and sampling height information with a desired two-dimensional pixel size in respect of the selected three-dimensional shape inspection region with respect to the detected picture signal, thereby calculating and determining a three-dimensional shape, whereby a defect caused by a deficiency in thickness or the like on a wiring pattern of a solid shape, formed on a detection object of a circuit board or the like, can be detected in a short period of time, and its device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.