Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
US6080291A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1998 |
| Grant date | Jun 27, 2000 |
| Priority date | — |
| Expiry date | Jul 10, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating apparatus, such as for electroplating of semiconductor wafers or like workpieces, includes a plating contact including an annular contact ring having an annular mounting portion, and an annular electrically-conductive contact portion extending inwardly of the mounting portion. The contact portion is configured for substantially continuous electrically-conductive contact with a peripheral region of the associated workpiece. The arrangement further includes an annular seal member mounted on the annular contact ring, with the seal member including a resiliently deformable annular seal lip portion adjacent to the contact portion of the contact ring. The seal lip is resiliently biased into continuous sealing engagement with the peripheral region of the workpiece when the workpiece is positioned in electrically-conductive contact with the contact ring. The apparatus includes a rotor assembly configured to receive the workpiece, and move the workpiece into operative contact with the annular contact ring and the annular seal member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.