Fixtures and methods for lead bonding and deformation
US6080603A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1999 |
| Grant date | Jun 27, 2000 |
| Priority date | — |
| Expiry date | Mar 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method for mounting a sheet-like microelectronic element, the sheet-like element comprises a dielectric layer having a top surface and a bottom surface and is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. A plurality of leads are formed on the bottom surface of the sheet-like element, the leads including bonding pads. In other embodiments, a method is provided for bonding bond pads on a sheet-like microelectronic element to contacts on a microelectronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.