Semiconductor device having separated exchange means
US6081030A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1998 |
| Grant date | Jun 27, 2000 |
| Priority date | — |
| Expiry date | Jun 26, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having separated exchange mechanism comprises a chip forming an integrated circuit; a connection substrate; device connection points or balls; and at least one exchange mechanism. The connection substrate comprises an external connection mechanism. The device connection points or balls are distributed in the form of a matrix and are located between the juxtaposed faces of the chip and of the connection substrate. The device connection points are connected to the external connection mechanism. The exchange mechanism comprises two parts. The two parts are arranged so as to be separated from each other and capable of exchanging signals between each other, in one or both directions. The first part is physically coupled to the chip. The second part is physically coupled to the connection substrate and is connected to the external connection mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.