Semiconductor package consisting of multiple conductive layers
US6081031A · kind A · utility
18Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1998 |
| Grant date | Jun 27, 2000 |
| Priority date | — |
| Expiry date | Jun 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a substrate (301, 801), a leadframe (101, 601, 710) coupled to a first surface of the substrate (301, 801) and extending beyond the first surface and towards a second surface of the substrate (301, 801), and an electrically conductive layer coupled to the second surface and coplanar with a contact portion of the leadframe (101, 601, 710) where the leadframe (101, 601, 710) and the electrically conductive layer form a package around the substrate (301, 801).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.