Methods of forming integrated circuitry and integrated circuitry structures
US6087263A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1998 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Jan 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/947
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one aspect, a plurality of layers are formed over a substrate and a series of first trenches are etched into a first of the layers in a first direction. A series of second trenches are etched into the first layer in a second direction which is different from the first direction. Collectively, the first and second trenches define a plurality of different substrate elevations with adjacent elevations being joined by sidewalls which extend therebetween. Sidewall spacers are formed over the sidewalls, and material of the first layer is substantially selectively etched relative to material from which the spacers are formed. Material comprising the spacer material is substantially selectively etched relative to the first material. In a preferred implementation, the etching provides a plurality of cells which are separated from one another by no more than a lateral width dimension of a previously-formed spacer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.