Baffle plate design for decreasing conductance lost during precipitation of polymer precursors in plasma etching chambers
US6093281A · kind A · utility
9Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1998 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Feb 26, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3244
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A baffle plate for semiconductor processing apparatus. The baffle plate includes a plurality of slits. A plurality of fins are located between adjacent slits. The fins have varying heights and a supporting portion interconnects the fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.