Process and device for polishing semiconductor wafers

US6095898A · kind A · utility

Assignee

• Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

• Heinrich Hennhofer · Tirschenreuth, DE
• Hans Kramer · Ede, NL
• Helmut Kirschner · Munich, DE
• Manfred Thurner · Ach, AT
• Thomas Buschhardt · Burghausen, DE
• Klaus Rottger · Munich, DE

Key dates

• Filing date: Oct 28, 1998
• Grant date: Aug 1, 2000
• Expiry date: Oct 28, 2018

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/042
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A process and device for polishing semiconductor wafers has at least one side of at least one semiconductor wafer pressed against a polishing plate, over which a polishing cloth is stretched. The semiconductor wafer and the polishing plate are moved relative to each other to polish the wafer. During the polishing, the semiconductor wafer passes over at least two regions on the polishing plate, which regions have defined radial widths and are at different temperatures. Temperature-control means are provided in the polishing plate, with the aid of which the number, the radial widths and the temperatures of the regions are fixed before the semiconductor wafers are polished.