Manfred Thurner
3Patents
2h-index
13Co-inventors
37Inventor score
Filing activity: Dec 9, 1997 → Jan 27, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6095898A | Process and device for polishing semiconductor wafers | Performing Operations; Transporting | 38 | Expired |
| US5980361A | Method and device for polishing semiconductor wafers | Performing Operations; Transporting | 33 | Expired |
| US6997776B2 | Process for producing a semiconductor wafer | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.