Semiconductor package including flex circuit, interconnects and dense array external contacts
US6097087A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1997 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Oct 31, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15173
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.