System for process data association using LaPlace Everett interpolation
US6098024A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1997 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Dec 5, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of utilizing associated process data parameters in the manufacture of semiconductor wafers by converting tool-based data to lot based data in order to predict wafer electrical test results from measured in-line critical dimensions, lot based data and the converted tool-based data. The converted tool-based data is obtained by interpolating data between a measurement obtained from a tool at a first time and a measurement obtained from the tool at a second time. The data association is obtained using LaPlace-Everett interpolation. The converted tool-based data can also be obtained by extrapolating data from the historical measurements taken from the tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.