Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes
US6098280A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1998 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Jan 5, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material with a plane of at least one electrically insulating material on both sides of the at least one plane of at least one electrically conducting material. The at least one core includes a plurality of plated through holes formed therethrough. At least one pad is provided over at least one of the plated through holes. The pad provides a flat surface for attaching an electronic device and also prevents solder from entering the at least one plated through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.