Hotplate offset ring
US6100505A · kind A · utility
6Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 27, 1999 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | May 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a hotplate offset ring of a unique construction for use in a heat treatment unit of wafer track system so as to achieve a more uniform heat transfer. In a preferred embodiment, this is achieved by a plurality of spacer tabs formed on the offset ring which prevent the possibility of non-uniformities in a gap formed between the wafer and the hotplate by eliminating any raised surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.