Patent · US Expired

Electron flood apparatus for neutralizing charge build-up on a substrate during ion implantation

US6100536A · kind A · utility

30Cited by
10References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 20, 1998
Grant dateAug 8, 2000
Priority date
Expiry dateMay 20, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/0041
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An Electron flood apparatus for neutralizing positive charge build-up on substrate during implantation of ions in a substrate by ion beam implantation apparatus. The electron flood apparatus comprises a tube for axially receiving and passing an ion beam to a substrate, an opening in a sidewall of the tube, a plasma chamber having an exit aperture in communication with said opening of said tube, a supply of inert gas to said plasma chamber, a high frequency power generator, and means to deliver high frequency power from said generator to maintain a plasma in said chamber to produce low energy electrons, whereby a flux of said low energy electrons emerges from said chamber through said exit aperture into said tube to merge with the ion beam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.