Semiconductor device having optoelectronic remote signal-exchange means
US6100595A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1998 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Jun 26, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor device includes a chip forming an integrated circuit; a connection substrate; an internal coupling mechanism; and at least one optical communication system. The connection substrate comprises an external coupling mechanism for electrically coupling to a device other than the chip. The internal coupling mechanism electrically couples the integrated circuit to the external coupling mechanism. The at least one optical communication system comprises two optoelectronic parts. The first optoelectronic part is either an emitter or a receiver which is integrated into the chip and constitutes one component of the integrated circuit. The second optoelectronic part is borne by the connection substrate and is able to be externally connected to the connection substrate. The second optoelectronic part faces the first optoelectronic part and is capable of exchanging light signals with the first optoelectronic part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.