Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
US6104596A · kind A · utility
30Cited by
18References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 21, 1998 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Apr 21, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck including a body of ceramic and a metal backing portion for mounting the chuck directly to a metal pedestal and a process of manufacturing the electrostatic chuck using sintering. The electrostatic chuck contains a metal backing portion having at least one hole extending therethrough and the body of ceramic includes at least one portion extending through the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.