Wafer stack and method of producing sensors

US6106735A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Jurgen Kurle · Reutlingen, DE
• Kurt Weiblen · Metzingen, DE
• Stefan Pinter · Reutlingen, DE
• Horst Muenzel · Reutlingen, DE
• Helmut Baumann · Gomaringen, DE
• Dietrich Schubert · Reutlingen, DE
• Karl Bender · Lörrach, DE
• Markus Lutz · Palo Alto, US

Key dates

• Filing date: Jan 12, 1998
• Grant date: Aug 22, 2000
• Expiry date: Jan 12, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/16235
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A wafer stack with sensor elements hermetically sealed in caverns and a method of fabricating the sensors permitting a reduction in the size of the sensors formed after cutting the wafer stack and also yielding considerable savings in chip area in the manufacture of the wafer stack. The wafer stack includes bonding strips arranged between the individual sensor elements. The wafer stack is diced to form individual sensors by sawing in the middle through the bonding strips.