Feedback loop for selective conditioning of chemical mechanical polishing pad
US6113462A · kind A · utility
56Cited by
8References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 1997 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Dec 18, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved method and apparatus for Chemical Mechanical Polishing (CMP) in integrated circuit processing utilizes a film measurement feedback loop for progressively optimizing the polishing pad conditioning recipe. By utilizing this invention, non-uniform pad wearing and elastic property variations are substantially corrected, and Within-Wafer-Non-Uniformity (WIWNU) is minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.