Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin
US6114450A · kind A · utility
2Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 1999 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | May 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin and/or a diepoxide resin admixed with tetrahydropyranyl-protected hydroxylmethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) optionally further containing an electrically or thermally conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.