Polishing apparatus
US6116994A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1998 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | Apr 10, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B47/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A compact polishing apparatus has been developed which can be installed in a relatively small space, and is highly rigid without increasing the weight of the apparatus. The polishing apparatus comprises a polishing table, a top ring head for rotatably holding a substrate, a substrate transfer device for transferring the substrate to and from a substrate storage section, a substrate delivery device for delivery of the substrate between the top ring head and the substrate transfer device at a delivery position outside of the polishing table. A guide rail device is laid between the polishing table and the substrate delivery device, and a carriage device movable along the guide rail device is provided for carrying the top ring device thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.