Flexible lead structures and methods of making same
US6117694A · kind A · utility
178Cited by
87References
56Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1999 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | Mar 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporary support which is removed after the bending operation and after injecting and curing a dielectric material to form a dielectric layer surrounding and supporting the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.