Brush assembly apparatus
US6119295A · kind A · utility
7Cited by
19References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1999 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Apr 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67028
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor processing system, such as a system for scrubbing both sides of a wafer at the same time, that includes a brush box containment apparatus for use with highly-acidic or other volatile chemical solutions, a roller positioning apparatus and a (brush) placement device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.