Heat sink chip package and method of making
US6122171A · kind A · utility
237Cited by
14References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1999 |
| Grant date | Sep 19, 2000 |
| Priority date | — |
| Expiry date | Jul 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.