Method and apparatus for achieving temperature uniformity of a substrate
US6123766A · kind A · utility
23Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1997 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | May 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T117/1008
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for controlling the temperature of a substrate in a processing chamber. The processing chamber employs a heating control over at least two heating zones. Each heating zone is independently controllable according to a measured signal corresponding to the substrate temperature and a user-definable offset.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.