Method for improving etch uniformity during a wet etching process
US6123865A · kind A · utility
33Cited by
10References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 7, 1998 |
| Grant date | Sep 26, 2000 |
| Priority date | — |
| Expiry date | Dec 7, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32134
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for improving etch uniformity during a wet etching process is disclosed. The method comprises the steps of first rinsing the wafer to form a water film over the wafer surface, followed by liquid phase etching. The water film helps the subsequent viscous etchant to be spread across the wafer surface more uniformly to thereby improve the etch uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.