Fuse, memory incorporating same and method
US6130468A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1998 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Feb 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a fuse and a fuse, together with systems and integrated circuits where the fuse provides benefits, are described. A fuse comprising a conductive material is formed on a substrate. A series of dielectric layers having a composite thickness is formed on the substrate and the fuse. The series of dielectric layers serves to insulate a series of conductive layers from each other. The conductive layers are disposed above portions of the substrate. An opening is formed extending through a passivation layer and the series of dielectric layers. The opening exposes a portion of the fuse. Another dielectric layer is formed on the fuse and the fuse may thereafter be programmed by directing a laser beam onto the fuse through the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.