Shielding method and apparatus for use in electroplating process
US6132583A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 16, 1997 |
| Grant date | Oct 17, 2000 |
| Priority date | — |
| Expiry date | May 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroplating system includes a tank that holds an electrolytic bath solution. An anode within the tank receives a first voltage having a first potential. A substrate cathode, immersible in the solution within the tank, spaced from the anode, receives a second voltage having a second potential, opposite to that of the first potential. A shield is immersible in the solution within the tank between the anode and cathode. The level of shielding provided by the shield is variable and controllable. In one embodiment, the shield includes a conductive element that receives a third voltage having the first potential, the magnitude of the third voltage being controllable. In another embodiment, the shield includes at least one louver, the physical orientation of which is controllably adjustable. The shield is sufficiently spaced from the substrate cathode to be substantially outside an area of sparging and is fixed between the anode and cathode. In an embodiment of the electroplating system, the substrate cathode is movable in horizontal directions toward and away from the anode while the shield is stationary in such horizontal directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.