Sucker for transferring packaged semiconductor device
US6135522A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1999 |
| Grant date | Oct 24, 2000 |
| Priority date | — |
| Expiry date | May 26, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A sucker for transferring packaged semiconductor devices is provided, which includes a position rod, an elastic buffer and a sponge. The position rod defines an air extraction channel in an axial direction thereof. The elastic buffer pad defines an aperture to hold an end of the position rod and a first air hole communicated with the aperture and the air extraction channel. The sponge is attached to the elastic buffer pad. The sponge defines a second air hole communicated with the first air hole. Therefore, when air is extracted through the air holes and air extraction channel, the sponge is provided with an absorbent force to securely catch a packaged semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.