Su Tao
77Patents
21h-index
72Co-inventors
87Inventor score
Filing activity: Jul 21, 1994 → Dec 18, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7002805B2 | Thermal enhance MCM package and manufacturing method thereof | Electricity | 92 | Expired |
| US6258626A | Method of making stacked chip package | Electricity | 92 | Expired |
| US6118176A | Stacked chip assembly utilizing a lead frame | Electricity | 88 | Expired |
| US6462421B1 | Multichip module | Electricity | 87 | Expired |
| US6252305A | Multichip module having a stacked chip arrangement | Electricity | 86 | Expired |
| US6229702A | Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability | Electricity | 65 | Expired |
| US6211574A | Semiconductor package with wire protection and method therefor | Electricity | 64 | Expired |
| US6191360A | Thermally enhanced BGA package | Electricity | 61 | Expired |
| US6215193A | Multichip modules and manufacturing method therefor | Electricity | 59 | Expired |
| US6359340B1 | Multichip module having a stacked chip arrangement | Electricity | 53 | Expired |
| US7321168B2 | Semiconductor package and method for manufacturing the same | Electricity | 52 | Expired |
| US6461897B2 | Multichip module having a stacked chip arrangement | Electricity | 44 | Expired |
| US6204559A | Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking | Electricity | 43 | Expired |
| US6822324B2 | Wafer-level package with a cavity and fabricating method thereof | Electricity | 31 | Expired |
| US6768207B2 | Multichip wafer-level package and method for manufacturing the same | Electricity | 28 | Expired |
| US6809852B2 | Microsystem package structure | Electricity | 27 | Expired |
| US6093960A | Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance | Electricity | 26 | Expired |
| US6534852B1 | Ball grid array semiconductor package with improved strength and electric performance and method for making the same | Electricity | 25 | Expired |
| US6201299A | Substrate structure of BGA semiconductor package | Electricity | 24 | Expired |
| US5474433A | Axial sealing mechanism of volute compressor | Mechanical Engineering; Lighting; Heating | 24 | Expired |
| US6348729B1 | Semiconductor chip package and manufacturing method thereof | Electricity | 23 | Expired |
| US6135522A | Sucker for transferring packaged semiconductor device | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6864168B2 | Bump and fabricating process thereof | Electricity | 16 | Expired |
| US6692581B2 | Solder paste for fabricating bump | Electricity | 16 | Expired |
| US6153939A | Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same | Electricity | 15 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.