Ceramic substrate having a sealed layer
US6136419A · kind A · utility
59Cited by
8References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1999 |
| Grant date | Oct 24, 2000 |
| Priority date | — |
| Expiry date | May 26, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a multilayer ceramic substrate, and a method for forming same, which has an outer unsealed layer having a metallic via, an inner sealed layer having a composite via of metallic and ceramic materials and a further unsealed layer having a metallic via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.