Chemical mechanical polishing apparatus with improved substrate carrier head and method of use
US6136710A · kind A · utility
10Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 1998 |
| Grant date | Oct 24, 2000 |
| Priority date | — |
| Expiry date | Oct 19, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved and new substrate carrier head for use in a CMP apparatus is described. The new substrate carrier head has a substrate retaining ring with embedded intersecting channels in the outer face. The embedded intersecting channels improve the circulation of polishing slurry to and from the polished substrate and polishing byproducts away from the polished substrate and thereby improve the polishing uniformity on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.