Conditioning ring for use in a chemical mechanical polishing machine
US6139428A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1996 |
| Grant date | Oct 31, 2000 |
| Priority date | — |
| Expiry date | Dec 17, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a conditioning ring for conditioning a polishing pad in a chemical-mechanical polishing machine. The conditioning ring is comprised of a ring having a diameter and a conditioning surface substantially parallel to a plane defined by the diameter. The conditioning ring has an inner radius surface to the plane defined by the diameter, wherein the inner radius surface is adapted to accept a wafer. The conditioning ring has an outer radius surface opposite the inner radius surface and an upper surface opposite the conditioning surface. The chemical mechanical polishing machine polishes the wafer by moving the polishing pad with respect to the wafer while the wafer is in contact with the polishing pad. The conditioning surface is adapted to frictionally contact the polishing pad. The conditioning surface conditions the polishing pad in response to a down force applied to the conditioning ring and as the chemical-mechanical polishing machine moves the polishing pad in relation to the conditioning surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.