Method and apparatus for pressure control in vacuum processors
US6142163A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1998 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Mar 31, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/7761
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method and apparatus is disclosed for controlling the pressure of a reaction chamber in wafer processing equipment. The disclosed apparatus and method uses a ballast port for inserting gas into the evacuation system, thereby controlling the pressure in the reaction chamber. The disclosed apparatus and method further uses estimation curves to estimate the desired position of a controlled gate valve which is located between the reaction chamber and turbo pump. The disclosed apparatus and method achieves a set point pressure by prepositioning a throttle valve followed by repositioning the throttle valve based on the difference between a measure pressure and the set point pressure using proportional and integral control, wherein enablement of integral control is delay for a pre-specified period.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.