Enveloping device and vertical heat-treating apparatus for semiconductor process system
US6142773A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 17, 1999 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Aug 17, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S277/914
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The process tube of a vertical heat-treating apparatus for semiconductor wafers has a port at the bottom to be opened and closed by a lid. A sealing mechanism is arranged to seal the connecting portion between the flange of the port and the flange of the lid. The flanges are provided with annular mirror surfaces on the inner side, which face and contact each other to form an inner seal. The flanges are also provided with annular counter surfaces on the outer side, which face each other with a gap therebetween. A metal sheet member is arranged in the gap such that an outer seal is formed by the metal sheet member and the counter surfaces. The metal sheet member has sheets vacuum-stuck onto the counter surfaces, respectively. A buffer space is formed between the inner and outer seals, and is vacuum-exhausted by an exhaust unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.