Method and apparatus to improve the side wall and bottom coverage in IMP process by using magnetic field
US6143140A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1999 |
| Grant date | Nov 7, 2000 |
| Priority date | — |
| Expiry date | Aug 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a method and apparatus for achieving conformal step coverage in a deposition process. In at least one aspect, a target provides a source of material to be sputtered by a plasma and then ionized by an inductive coil. At least a portion of the electrons provided by the plasma and ionized target material are deflected by a magnetic field established adjacent to the substrate. Under the influence of the attracted electrons, positively charged particles are induced to move in the direction of the electrons. The magnetic field may be provided by one or more magnets located internally or externally to the processing chamber and which can be rotated to ensure uniform deposition of the electrons and ions on the device features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.