Wafer transfer cassette
US6145673A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1999 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Mar 31, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6732
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer cassette of the kind which includes a support frame, a first wafer supporting construction, and a second wafer supporting construction. The support frame includes first and second vertically extending support structures which are horizontally spaced from one another. The first wafer supporting construction includes a first bracket portion and a first fin portion extending from the first bracket portion. The first bracket portion is mounted to the first support structure in a position wherein the first fin portion extends from the first bracket portion towards the second support structure. The second wafer supporting construction includes a second bracket portion and a second fin portion extending from the second bracket portion. The second bracket portion is mounted to the second support structure in a position wherein the second fin portion extends from the second support structure towards the first support structure. The first and second fin portions have upper surfaces positioned relative to one another to jointly support a wafer in substantially a horizontal orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.