Method for laser scanning flip-chip integrated circuits
US6146014A · kind A · utility
13Cited by
22References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1998 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Nov 4, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K11/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods for analyzing temperature characteristics of an integrated circuit. In one embodiment, a beam of laser light is directed at the back side of an integrated circuit. The intensity level of laser light reflected from the integrated circuit is measured and compared to a reference intensity level. The magnitude of the difference between the reference intensity level and the intensity level of the reflected laser light is indicative of a temperature characteristic of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.