Apparatus and method for aligning a substrate on a support member
US6146463A · kind A · utility
373Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1998 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Jun 12, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/135
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and arrangement for lifting lowering and centering a substrate on a surface employs lift pins have conical tips. A capture range is provided by the conical tips to capture and center misaligned wafers. One or more of the pins are inclined in certain embodiments to enhance the alignment capability of the lift pins. The inclined lift pins, when retracting into a support member at an angle, move a supported substrate horizontally into proper alignment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.