Sputtering method and apparatus with small diameter RF coil
US6146508A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1998 |
| Grant date | Nov 14, 2000 |
| Priority date | — |
| Expiry date | Apr 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for sputtering ionized material onto a workpiece with the aid of a plasma which ionizes the material, utilizing: a support member having a workpiece support area for supporting a workpiece that has a given diameter; a target constituting a source of material to be sputtered; and a coil located between the target and the workpiece support for creating a plasma which ionizes material sputtered from the target, the coil enclosing a region, the support member being maintained at a potential which causes ionized material to be attracted to the support member. The coil is configured and operated to shape the plasma in a manner to promote redirection of material sputtered from the center of the target back to the target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.