Method of and apparatus for cleaning substrate
US6151744A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1997 |
| Grant date | Nov 28, 2000 |
| Priority date | — |
| Expiry date | Apr 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67046
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of and apparatus for cleaning a substrate which require shorter processing time with high processing efficiency are disclosed. A cleaning brush pivots about a pivot axis between two positions. An ultrasonic cleaning nozzle pivots about a pivot axis between two positions. To perform a cleaning process, the cleaning brush and the ultrasonic cleaning nozzle are driven in accordance with a processing pattern previously produced by an operator. The processing pattern is produced so that the movement of the cleaning brush between two positions and the movement of the ultrasonic cleaning nozzle between two positions are not caused simultaneously. Any processing pattern desired by the operator may be produced if this requirement is satisfied. Execution of the cleaning process in accordance with the processing pattern allows cleaning of a substrate using the cleaning brush and the ultrasonic cleaning nozzle at the same time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.