Concentric platens
US6152806A · kind A · utility
22Cited by
6References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 14, 1998 |
| Grant date | Nov 28, 2000 |
| Priority date | — |
| Expiry date | Dec 14, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus includes a plurality of concentric rotatable platens for polishing a substrate. A polishing pad is attached to each platen. Each platen may be rotated independently in either clockwise or counter-clockwise direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.